The new parts aren't in mass production yet, but they'll likely replace most consumer RAM in the coming years.

The LPCAMM2 design is part of an ongoing effort to replace soldered LPDDR in mobile and ultra-thin systems with memory that is both upgradeable and space-efficient.

Designed to take on high-bandwidth memory in data centers, Z-Angle memory (ZAM) leverages diagonal interconnects for improved thermal conductivity.