In the center of this technological transition, Future Leading SiSiC/RBSIC/silcon carbide Cantilever Paddle products are emerging as a key solution for stable wafer handling and continuous kiln ...
MUNICH — Electroglas Inc. today at the Semicon Europa trade show here introduced a new test-handling solution for devices in wafer-level packages, unpackaged known-good die products, thin wafers, ...
SUNNYVALE, Calif. — In what could boost the cycle times in chip production, Genmark Automation Inc. here has added a built-in wafer-mapping sensor to its line of wafer handling equipment. “The built ...
Third-party sensors are being added into fab equipment to help boost yield and to extend the life of expensive tools, supplementing the sensors that come with equipment used in fabs. The data gleaned ...
Wafer breakage is the most serious impact of killer crystalline defects. About 0.1 to 0.2% of silicon wafers break. The higher the number of wafer breakages, the slower the time to market. Given the ...