Artificial intelligence chip startup SiMa Technologies Inc. today announced it’s shipping its second-gen system-on-chip platform specifically designed for multimodal physical AI workloads. The new ...

Like any successful system-on-chip (SoC) effort, a multi-die system-in-package (SiP) project must start with a sound system design. But then what? Are the steps in the SiP design flow different from ...

Forbes contributors publish independent expert analyses and insights. Dave Altavilla is a Tech Analyst covering chips, compute and AI. In a joint announcement reflecting the growing importance of ...

Xiaomi founder and CEO Jun Lei announced on May 19 via Weibo that the company will unveil its first 3nm mobile system-on-chip (SoC), the "Xring O1," on May 22. He also revealed that Xiaomi plans to ...

Synopsys Inc. (NASDAQ:SNPS) is one of the best software infrastructure stocks to invest in. On June 26, Frost & Sullivan announced that Synopsys had been honored with the 2025 Global Technology ...

Khalifa University is building the foundation for a smarter, more secure and more connected world, one silicon chip at a time. In the rapidly evolving world of artificial intelligence and smart ...

Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...

The semiconductor industry has spent decades mastering the art of integrated circuit physical verification. But as system-on-chip (SoC) designs push the boundaries of complexity—with more transistors, ...