One of the most cutting-edge packaging technologies to recently emerge in the electronics marketplace is the quad flat no leads (QFN)-type package. It serves as an alternative to the more costly ...

Dublin, July 29, 2025 (GLOBE NEWSWIRE) -- The "eFuse Market by Type, Packaging Type, Application, Vertical, and Region - Global Forecast to 2030" has been added to ResearchAndMarkets.com's offering.

SAN DIEGO--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital ...

Housed in QFN packages, the 24-bit MSC1201 and MSC1202 precision data acquisition chips integrate a low-noise delta-sigma A/D converter, an enhanced 8051 processor core, 4 or 8 Kbytes of flash memory, ...

New York, March 23, 2023 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Global Quad-Flat-No-Lead Packaging Market Size, Share & Industry Trends Analysis Report By Moulding ...

The semiconductor shortage has curtailed the choices available to designers and caused some inventive solutions to be found, but the one used by [djzc] is probably the most inventive we’ve yet seen.

The latest addition to ST’s VIPerGaN series delivers 65 W in a thermally enhanced QFN package for USB-PD chargers, fast battery chargers, and auxiliary power supplies.

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

Housed in a 3 x 3 mm QFN package with ESD protection on all pins, the RF2861 single-band, front-end receiver also integrates a TX LO buffer amplifier. Designed for CDMA, JCDMA and CDMA450 applications ...

The world of console modding leads us to some extremely impressive projects, and a recent one we featured of note was a portable NES produced by [Redherring32]. It was special because the original NES ...