The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dies are ...

FedEx Corp. said its TechConnect division has opened a 30,000-square-foot package laboratory to provide testing and design services. The laboratory can simulate any part of the FedEx network, from ...

Natalie Finazzo is leading the firm's expansion. DDL Inc. (Minneapolis) is keeping pace with the growth of the packagetesting market by expanding to Boston. The company's package engineer, Natalie ...

The emphasis on heterogeneity is increasing the burden on OSATs and foundries to make sure everything works as expected inside a package. Putting a variety of chips or hardened IP blocks into a ...

AGOURA HILLS, Calif. — Making a more aggressive push into the wafer-probe space, Teradyne Inc. has unveiled a memory test system with an architecture specifically designed for high-parallel test and ...