TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...

Advanced Interconnect Technologies Inc. (AIT) has announced two new versions of its lead-frame package family that the company claims combine the best attributes not only of lead-frame but of array ...

This family of lead-frame packages has been extended to include dual-sided units. Said to combine the performance of array packages with the lower cost of lead frames, the dual, fine-pitch, no-lead ...

Dai Nippon Printing Co (DNP) has developed a new lead frame in response to efforts to slim down the semiconductor package mounted on electronic devices, including mobile terminals and PCs. Using this ...

PLEASANTON, Calif. — Advanced Interconnect Technologies Inc. (AIT) said today (April 28, 2003) it has developed a style of package it calls flip-chiip on standard leaded (FCOSL) packages. These ...

Australian technology firm Lednium has developed a domed lead-frame package to improve light distribution in LED lighting. “It is a natural progression when creating a source of Illumination from what ...

Report Ocean published the latest research report on the Semiconductor Lead Frame Market. In order to comprehend a market holistically, a variety of factors must be evaluated, including demographics, ...

DNP has taken advantage of our microfabrication technology developed over many years to successfully achieve the configuration of lead frame silver plated area of ±25um. It has also been possible to ...