A cooler CPU isn't going to magically fix all your issues ...

But on Tuesday, Nvidia CEO Jensen Huang poured cold water on the idea that the AI boom was also creating an HVAC boom. Huang ...

Using a through-hole interconnection method to enable the bonding of chips at room temperature, a new stacked-chip technology promises reductions in package thicknesses by more than 60%. The ...

Data center rack density has risen rapidly in recent years. Operators are cramming more computing power into each server rack to meet the needs of AI and other high-performance computing applications.

A new microprocessor fabrication process could make geothermal energy more attainable by offering chips that can operate at high temperatures deep inside the Earth. Share on Facebook (opens in a new ...