Open-source tools and multi-project wafer (MPW) shuttles democratize chip design for low cost. Small circuits, both analog and digital, are accommodated by embedding them as “tiles” or “clusters” into ...
Launching a pilot 'chip design to tapeout' flow curriculum, enabling academic institutions with industry-aligned coursework. Pilot testing underway at over 40 select worldwide universities with intent ...
Chip design is starting to include more options to ensure chips behave reliably in the field, boosting the ability to tweak both hardware and software as chips age. The basic problem is that as ...
Cadence Design Systems is a mission-critical enabler of next-gen industries, boasting high recurring revenues, robust client retention, and an AI-driven product portfolio. The company’s oligopolistic ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence (Nasdaq: CDNS) today announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced ...
Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...
SUNNYVALE, Calif., Sept. 3, 2025 — Today Synopsys (Nasdaq: SNPS) announced expanding Synopsys.ai Copilot generative AI (GenAI) capabilities for its industry-leading semiconductor design solutions, ...
For decades, the design of leading-edge chips has been a high-wire act—balancing tight deadlines, sophisticated workflows, and the relentless need to consult scattered, often outdated, sources of ...
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