AZOM

CMP Process: Online Monitoring of Hydrogen Peroxide

A fundamental component of modern electronic goods is the semiconductor. More powerful, faster and smaller processors are in constant demand for many services and goods because of the advent of the ...
Semiconductor Engineering

Creating An Accurate FEOL CMP Model

For decades, semiconductor manufacturers have used chemical-mechanical polishing (CMP) as the primary technique for the smoothing and leveling (planarization) of dielectrics and metal layers. CMP ...
AZOM

Enhancing Chemical Mechanical Planarization (CMP) Yield Through Multivariable Process Monitoring

Effective fabrication of complex, high performance semiconductor devices is highly dependent on the use of chemical mechanical planarization (CMP). This process is used to planarize the wafer surface ...
Semiconductor Engineering

Reducing Rework In CMP: An Enhanced Machine Learning-Based Hybrid Metrology Approach

The semiconductor industry is constantly marching toward thinner films and complex geometries with smaller dimensions, as well as newer materials. The number of chemical mechanical planarization (CMP) ...
EDN

Applied drives CMP process control down to 45 nm and smaller

To allow real-time control of dielectric chemical mechanical planarization (CMP) processes to the 45 nm device node and beyond, Santa Clara, Calif.-based semiconductor manufacturing equipment leader ...
EDN

France’s CMP offers access to ST’s 65-nm process

LONDON — Circuits Multi Projets (CMP), a multiproject wafer run aggregator, has introduced access to a 65-nanometer CMOS process from STMicroelectronics NV. The ST 65-nm library includes process ...