Having just received a shiny set of PCBs from the fab-house [Devbisme] needed a way to solder the main chip in place. It has a Ball-Grid Array footprint which is notoriously difficult to populate in a ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

If you’re developing a performant IP-KVM based on the Raspberry Pi, an HDMI capture device that plugs into the board’s CSI port would certainly be pretty high on your list of dream peripherals. Turns ...

Constructed with a high-temperature RoHS-compliant glass-reinforced material, a BGA-to-BGA adapter resolves soldering issues that arise when devices with RoHS-compliant BGA solder balls are mated with ...

Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...