SK Hynix Inc. is preparing a major capacity push as the global race to build AI-ready data centres strains the memory supply chain. The South Korean chipmaker plans to invest 19 trillion won ($12.9 ...

FICG cordially invites industry professionals to visit Booth A521 at APE 2026 to discuss high-speed optical transceiver ...

How atomic-layer deposition and hybrid dielectrics are redefining reliability and scaling for AI-era semiconductors.

Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...

On January 28, 2026, in Hanoi, FPT Corporation officially announced the establishment of the FPT Advanced Semiconductor ...

The group is also building an OSAT facility. This is in view of a larger plan to create a hub for chiplet integration and advanced system-in-package technologies.

Amkor Technology is rated Buy, driven by strategic partnerships with Nvidia and strong positioning in advanced semiconductor packaging. AMKR's $7B Arizona facility, supported by US Chips Act funding, ...

FPT Group on Wednesday announced the establishment of its Advanced Semiconductor Testing and Packaging Plant, making it the ...

eSpeaks’ Corey Noles talks with Rob Israch, President of Tipalti, about what it means to lead with Global-First Finance and how companies can build scalable, compliant operations in an increasingly ...

A new technical paper titled “Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation technology for advanced electronic packaging” was published by researchers at ...

Average Al chip-package size to triple by 2030 for more memory and computing cores Advanced packaging is becoming a core driver of semiconductor performance and profitability as artificial ...

TSMC's dominance in advanced process and packaging has made it a prime target amid US manufacturing mandates. Chip customers ...